Our Capabilities

• Wirebonding

Wedge, ball Ribon
Au/Al/Cu
Deep Access
Ultra Fine Pitch
Wire Pull Testing
(Destruct/Non Dstruct)
Insulated Wire Bonding

• Die Attach

Eutectic
Epoxy
Solder
Non Conductive
Die Bumping
Die Stacking
Chip On Board/Glass

• Ring Frame/Lead Attach

Epoxy Lid Attach
Solder Lid Attach

• Thick Film Multilayer Screen Printing

Ceramic — AI203, aln
Conductors – Au, Ag, Pt/Au, Pg/Ag
Resistors — 1-100 MΩ
Deilectics
Overglaze